頎邦 (6147.TWO)

67.10 -0.20 (-0.30%) 收市：01:30PM CST

頎邦

No.3, Li Hsin 5th Rd
Hsinchu Science Park
Hsinchu City 300
Taiwan
886 3 567 8788
https://www.chipbond.com.tw

版塊: Technology
行業: Semiconductor Equipment & Materials
全職員工: 

高階主管

名稱	頭銜	支付	行使價	出生年份
Mr. Huoo-Wen Gau	CEO & Director	12.06M	無	無
Mr. Cheng-Hung Shih	President	無	無	無
Mr. Shi-wei Luo	CFO, Corporate Governance Officer, SVP of Management Center & Company Secretary	無	無	無
Ms. Chao-Yi Wang	Accounting Director & Senior Director of Investment Division	無	無	無
Mr. In-Shek Hsu	Senior Vice President of Sales/MKT Planning Center	無	無	無
Mr. Sheng-Jen Wu	Senior Vice President of Manufacturing Center	無	無	無
Zong-Yu Tu	Vice President	無	無	無
Tsung-Hua Wu	Vice President	無	無	無
Shyh-Wey Lo	Senior Vice President	無	無	無

截止 2022年12月31日為止計算的金額，現金賠償則計算至上一個財政年度末止。薪資是指薪俸、獎金等。已行使價是指財政年度期間已行使的期權價值。貨幣為 TWD。

描述

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductor; invests in, develops, manufactures, and sells electronic components; and manufactures and sale of elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.

公司管治

截至 無 止，頎邦 的 ISS 管治質素評分為 無。 Pillar 分數正在審核中：無；董事會：無；股東權利：無；現金賠償：無。

企業管治評分的資料提供： Institutional Shareholder Services (ISS). 評分將以 1 至 10 分顯示 (與指數或地區相關)。1 分表示較低的管治風險，而 10 分表示較高的管治風險。