| 前收市價 | 76,300.00 |
| 開市 | 77,800.00 |
| 買盤 | 76,700.00 x 0 |
| 賣出價 | 76,800.00 x 0 |
| 今日波幅 | 76,500.00 - 77,900.00 |
| 52 週波幅 | 63,600.00 - 86,000.00 |
| 成交量 | |
| 平均成交量 | 20,326,430 |
| 市值 | 510.794T |
| Beta 值 (5 年，每月) | 0.85 |
| 市盈率 (最近 12 個月) | 無 |
| 每股盈利 (最近 12 個月) | 無 |
| 業績公佈日 | 2024年4月30日 |
| 遠期股息及收益率 | 1,805.00 (2.35%) |
| 除息日 | 2023年12月27日 |
| 1 年預測目標價 | 101,772.00 |
BenzingaAMD and Samsung Partner To Boos MI350 Chip Capabilities with Advanced Memory Tech
Advanced Micro Devices, Inc (NASDAQ:AMD) signed a contract with Samsung Electronics (OTC:SSNLF) to supply HBM3E (5th generation high bandwidth memory) valued at approximately $3 billion (4 trillion won for its new data center chip, the MI350. Samsung Electronics has agreed to provide AMD with 12-layer HBM3E DRAM, slated for mass production in the year’s first half. Samsung started supplying samples to customers in February. The deal is worth about $3 billion (KRW 4.134 trillion), Viva 100 report
BenzingaSamsung's Latest 3D NAND Memory Chips Transform AI Data Centers and Mobile Devices
On Tuesday, Samsung Electronics Co (OTC:SSNLF) announced that it has started mass production of the world’s most advanced 286-layer NAND flash memory chips, which offer increased data storage capacity. The company’s ninth-generation 3D NAND memory, which surpasses the 236-layer eighth-generation version by expanding bit density by 50%, will be utilized in artificial intelligence data centers and smartphones, Nikkei Asia reports. U.S. tech companies like Alphabet Inc (NASDAQ:GOOG) (NASDAQ:GOOGL)
鉅亨網AI需求加持 今年QLC Enterprise SSD出貨位元大增四倍
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