Samsung Electronics Co., Ltd. (005930.KS)
- Benzinga
AMD and Samsung Partner To Boos MI350 Chip Capabilities with Advanced Memory Tech
Advanced Micro Devices, Inc (NASDAQ:AMD) signed a contract with Samsung Electronics (OTC:SSNLF) to supply HBM3E (5th generation high bandwidth memory) valued at approximately $3 billion (4 trillion won for its new data center chip, the MI350. Samsung Electronics has agreed to provide AMD with 12-layer HBM3E DRAM, slated for mass production in the year’s first half. Samsung started supplying samples to customers in February. The deal is worth about $3 billion (KRW 4.134 trillion), Viva 100 report
- Benzinga
Samsung's Latest 3D NAND Memory Chips Transform AI Data Centers and Mobile Devices
On Tuesday, Samsung Electronics Co (OTC:SSNLF) announced that it has started mass production of the world’s most advanced 286-layer NAND flash memory chips, which offer increased data storage capacity. The company’s ninth-generation 3D NAND memory, which surpasses the 236-layer eighth-generation version by expanding bit density by 50%, will be utilized in artificial intelligence data centers and smartphones, Nikkei Asia reports. U.S. tech companies like Alphabet Inc (NASDAQ:GOOG) (NASDAQ:GOOGL)
- 鉅亨網
AI需求加持 今年QLC Enterprise SSD出貨位元大增四倍
隨著節能成為 AI 推論伺服器優先考量，北美客戶擴大存儲產品訂單，帶動 QLC Enterprise SSD 需求開始攀升，TrendForce 指出，目前僅 Solidigm 及三星 (Samsung) 有 QLC 產品獲得驗證，預期今年 Q
