Amkor Technology, Inc.
2045 East Innovation Circle
Tempe, AZ 85284
United States
480 821 5000
https://amkor.com
版塊: Technology
行業: Semiconductor Equipment & Materials
全職員工: 28,700
高階主管
| 名稱 | 頭銜 | 支付 | 行使價 | 出生年份 |
|---|---|---|---|---|
| Mr. James J. Kim | Executive Chairman of the Board | 1.92M | 無 | 1936 |
| Mr. Giel Rutten | President, CEO & Director | 2.01M | 830.9k | 1957 |
| Ms. Susan Y. Kim | Executive Vice Chairman | 224.01k | 無 | 1963 |
| Ms. Megan Faust | Executive VP, CFO & Treasurer | 943.78k | 794.99k | 1974 |
| Mr. Mark N. Rogers | Executive VP, General Counsel & Corporate Secretary | 863.88k | 無 | 1966 |
| Mr. Farshad Haghighi | Executive VP & Chief Sales Officer | 1.63M | 108.83k | 1963 |
| Mr. Kevin Engel | Executive Vice President of Business Units | 717.28k | 98.73k | 1972 |
| Ms. Jennifer Jue | Vice President of Investor Relations & Finance | 無 | 無 | 無 |
| JinAn Lee | Executive Vice President of Worldwide Manufacturing | 無 | 無 | 無 |
描述
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company also provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. The company was founded in 1968 and is headquartered in Tempe, Arizona.
公司管治
截至 2024年4月29日 止，Amkor Technology, Inc. 的 ISS 管治質素評分為 5。 Pillar 分數正在審核中：4；董事會：8；股東權利：5；現金賠償：4。
